Micromolding is the perfect option for creation of the smaller devices and the tiniest components. This modern technology in recent years has found its way into overmolding, which opened the broad horizons for affordable electronics. Let’s look closer at these concepts and reveal their advantages.

Micromolding and how it helps startups save on low-volume injection molding

Micromolding is needed for details with weight from a gram to a microgram and with a size from 50µm to 5µm. This process differs from traditional technology because the machines for injection are really tiny and precise. They provide the injection of the smallest quantities, while the resolution is high and the pressure is distributed evenly.

Tinier molds are required. Their cores and cavities should be of micro size. That is why package and quality control stages also become of more importance.

Because of small size of modern electronic devices, this sector highly evaluates such technologies. Its’ benefits are used for:

  • microoptics and manufacturing such devices as a lens, smart phone, laser, prism;
  • microelectronic details and components for different types of electronic devices, examples of which are a connector, switch, plug, computer chip.

Also, micromolding is required for microelectromechanical systems. These modern features are of high interest because of their biological and medicinal utilization.

Many industries apply micromolding and low volume molding in their technological processes, but in the world market, the electronic sector is getting one of the highest positions.

Overmolding details and its advantages

When for a creation of a single detail two or more materials are combined, the technology is called overmolding. It protects sensitive parts and makes the resulting product more good-looking and of better quality.

The ground material is a substrate; the cover of the second one is an overmold, generally made of some kind of plastic or elastic polymer.

Overmolding provides the following advantages for a wide range of industrial applications such as solar panels, medicinal and military equipment, electronics, namely:

  • reducing of costs of production;
  • improving quality indicators;
  • making the design flexible.

In the area of electronics, wire overmolding becomes one of the important issues. It results in higher durability, flexibility, shear resistance. Furthermore, insert molding is utilized for the preparation of combined parts from two different starting materials.

The described process gives the highest possible protection from external factors for wires and other similar components. The new area for further investigations is electronic silicon process, which is especially valuable and highly interesting for the electronics area.

Statistics indicates that the size of the market of molded parts in the area of electronics is growing year after year. In ten years, it may reach more than $1 billion. Therefore, the combination of micromolding and overmolding in order to provide affordable components of a good quality and reasonable prices is very promising.